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| 职 位 名 称 |
Die Attach Engineer |
| 公 司 信 息 |
An Amercian company in semi conductor industry |
| 职 位 描 述 |
Job description:l Familiar to MOSFET leadframe and Clip design and developmentl Line EQ Automation interface & linkagesl FOL new technologies platform developmentl Partnership with vendor driving Leadframe and Clip tooling design developmentRequirements as below:l |
| 职 位 要 求 |
Bachelor degree at least, Master is preferred.l Process engineering or
development engineering experience in FOL process, especially on Die
attach or clip attach.l Be familiar with ASM838,ASM 832I, ASM AD-8312 |
| 发 布 时 间 |
2023-08-07 |
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