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| 职 位 名 称 |
R&D Section Manager |
| 公 司 信 息 |
An American Company |
| 职 位 描 述 |
1) To lead RD engineers/ technicians/operators of Die bond, clip bond and wire bond for new package development and new product introduction.2) The job scope includes design and tooling review, material selection, machine evaluation and buy off, process development , DFMFA , control plan and quality specifications creation.3) Familiar with JMP and DOE4) WELL knowledge on die bond , clip bond and wire bond of lead-frame base packages.5) Master, above 5 years experiences or Bachelor with more than 8 years experience. |
| 职 位 要 求 |
1) To lead RD engineers/ technicians/operators of Die bond, clip bond and wire bond for new package development and new product introduction.2) The job scope includes design and tooling review, material selection, machine evaluation and buy off, process development , DFMFA , control plan and quality specifications creation.3) Familiar with JMP and DOE4) WELL knowledge on die bond , clip bond and wire bond of lead-frame base packages.5) Master, above 5 years experiences or Bachelor with more than 8 years experience. |
| 发 布 时 间 |
2021-08-05 |
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