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| 职 位 名 称 |
R&D Manager(Shanghai) |
| 公 司 信 息 |
An American wholly owned,Fortune 1000 company.One of its operations in SH is in the industry of semi conductor, locating in Jiading District. |
| 职 位 描 述 |
Design, development and implementation of advanced surface mount packages for power MOSFET and IC devices as well as new assembly processes.
Performing scientific studies which lead to solutions of issues related to package characterization and failure analysis in both commercial and automotive applications. This includes thermo-mechanical modeling of new packages and assembly processes.
Working closely with Taiwan and Santa Clara package development teams on package technology transfer programs such as bond wireless, clip, soldering, electroless plating and wafer bumping.
Coordinating with process engineering and production groups in Simconix for fast release to manufacturing of new package |
| 职 位 要 求 |
MS degree in engineering of physics.
Minimum of 5 years hand-on experience in the development and design of advanced surface mount packages for microelectronics.
Background in soldering and electroless plating is a plus.
project management experience
written and verbal communication skills. |
| 发 布 时 间 |
2014-09-25 |
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