| |
|
| 职 位 名 称 |
Wire bond staff Engineer |
| 公 司 信 息 |
An American company |
| 职 位 描 述 |
Primary Responsibilities:· Develop robust Cu bonding process capability on Power packages with bond Al, AuPdNi front metallization and Ag or bare Cu leadframe plating surfaces· Working closely with R & D and operation to release new Commercial and Automotive products with 1.3mil, 1.5mil. 2.0mil Bare Cu, PCC, APCC wire sizes into mass production· Cu wire bond process knowledge transfer to process engineering team· Cu wire bonding qualification and ramp up in leaded and leadless packages· Leading assembly project in new product development and introduction· Good hands on experience with ASM and/ or KnS bonders· Min 2 years good Copper bonding hands on experiences |
| 职 位 要 求 |
Requirements:· Bachelor’s degree in Mechanical, electrical, industry engineering· At least 5 years’ experience in semiconductor assembly and 2 years in project management· Fluent speak, read & write English |
| 发 布 时 间 |
2021-01-13 |
|
|
